Thermal Conductivity & Heat Transfer Measurement for Ceramic Shell Molds

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Product Description

PaperID: 870
 
EventID: 4
 
Author: Michael J. Hendricks and Donald R. Engelhardt, Ransom & Randolph
 
Keywords: Ceramics and Mold Making
 
Paper Pages:15
 
Paper Year: 1993
 
Paper Index: 2.157
 
Paper Source: 54