Product Description
PaperID: 871
EventID: 4
Author: M. J. Hendricks and D. R. Engelhard, Ransom & Randolph
Keywords: Ceramics and Mold Making
Paper Pages: 14
Paper Year: 1993
Paper Index: 2.15
Paper Source: 53
Thermal Conductivity and Heat Transfer Measurement for Ceramic Shell Molds
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